PCB Fabrication Capabilities
| STANDARD | SPECIAL | |
| Trace Width / Trace Spacing | 0.006 / 0.006" | 0.004 / 0.004"(UL) |
| Component Pad Pitch-SMD |
0.050" (1.27mm) |
0.020" (0.5 mm) |
| Via Hole Diameter | 0.015 ins. | 0.008 ins. |
| Via Pad Size | 0.030 ins | 0.020 ins. |
| Drill Clearance on Inner Planes | 0.015 ins. | 0.010 ins. |
| Trace to Board Edge | 0.025 ins. | 0.010 ins.(UL) |
| Unpierced Copper | 2.5 ins.(UL) | N/A |
| Multi-layer Count | 4 - 16 | 18 + |
| Multi-layer Minimum Thickness | 0.024 ins. | 0.024 ins.(UL) |
| Dielectric Core Thickness | 0.005 ins. | 0.005 ins.(UL) |
| Dielectric Prepreg (bonding) | 0.0025 ins. | 0.0025 ins. |
| Final Finish | Solder Level |
|
| Solder Resist | Screen or Liquid Photo | Custom Color |
STANDARD: Implies the most economical for manufacturing.
SPECIAL: May incur additional charges. Contact us for further information.
ADDITIONAL SERVICES:
Wire Bondable Gold.
100% Net List Bare Board Testing.
Carbon paste.
Enclosure and face plate silkscreening.